Adhesives are used primarily to attach components, such as module lids and
baseplates, within electronic modules and to seal openings in a module to
exclude dirt, water or other contaminants.
|
If you need a
material:
|
Consider
products:
|
|
To be used in stress-sensitive applications
|
With low durometer values
|
|
For use around heat-sensitive components that cannot withstand high cure
temperatures
|
That cure at room temperature or with moderate heat
|
|
For use without the need for mixing
|
That are one part
|
|
For rapid processing
|
With fast cure times
|
|
That will remain in place where applied during cure
|
That are nonslumping
|
|
That will flow and self-level
|
With low to moderate viscosity values
|
|
That will fill small spaces
|
With the lowest viscosity values; or, with higher viscosity products, use
vacuum during processing
|
|
That cures in thick sections above 1/8 inch (3 mm)
|
That are heat curing
|
|
With good strength
|
With higher tensile values
|
|
With very low levels of outgassing
|
That have low-volatility properties
|
|
That have been tested to common industry standards
|
That have been classified by Underwriters Laboratories and/or meet military
specifications
|
|
Search Using the Product
Finder
|
|
Learn More
from the Product Tutorial
|
|
View the Product Family
Overview
|
Change
