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For Module Sealing select one of Dow Corning's Adhesive/Sealants. Here are
some items for considerations in choosing the appropriate material for your
use:
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One or two-part heat curing adhesive/sealants offer higher throughput and
faster processing times. Heat cure times typically are shorter with increasing
temperatures. If heat cure is not practical choose a room temperature curing
product.
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One-part materials are easier to handle, two-part materials often offer
faster processing. Two-part materials are typically 1:1 mix ratio with a few at
10:1.
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For module sealing, flowable materials are generally preferred for use in
grooves or when applied over large areas. Non slump materials are preferred for
perimeter sealing or for beads on flat surfaces.
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A number of these products have UL or Mil Spec approvals.
Additional Information:
Adhesive/Sealant
Product Information
Adhesives/Sealants
Tutorial
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