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Key Characteristics and Properties of Adhesives
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Key Characteristics
Dow Corning ® Adhesives generally possess the following characteristics:
- Low stress after curing which can significantly enhance reliability of the
electronic part
- Maintains these stress-relieving properties even after aging for long times
in severe environments
- Excellent unprimed adhesion
- Minimal shrinkage during cure
- No heat generated (no exotherm) during cure
- No solvents or cure by-products
- Excellent dielectric properties
- Service range of –45 to 200C (-49 to 392F)
- Low toxicity
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Certain products also include such properties as:
- Fast RT cure
- Fast tack time/Quick green-strength development
- Improved cure times at lower temperatures for heat curing adhesives
- Formation of protective layers on certain metals which can reduce corrosion
and metal migration
- One-part formulations are available with no need for meter-mixing before
use
- A range of flow properties to suit application and process needs from
self-leveling to non-flowing
- Color tinting for easy inspection and identification of separate components
in two-part formulations
- Inclusion of spacer beads to maintain consistent bond line thickness
- UV dyes for easy inspection
- Enhanced thermal conductivity
- UL flammability and MIL Spec compliance
- Enhanced flame resistance
- Controlled volatility
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To find a product with the characteristics you want, check the Product
Finder.
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