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Adhesives and Sealants


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Key Characteristics and Properties of Adhesives

Key Characteristics

Dow Corning ® Adhesives generally possess the following characteristics:

- Low stress after curing which can significantly enhance reliability of the electronic part
- Maintains these stress-relieving properties even after aging for long times in severe environments
- Excellent unprimed adhesion
- Minimal shrinkage during cure
- No heat generated (no exotherm) during cure
- No solvents or cure by-products
- Excellent dielectric properties
- Service range of –45 to 200C (-49 to 392F)
- Low toxicity

Road sensors

Certain products also include such properties as:

- Fast RT cure
- Fast tack time/Quick green-strength development
- Improved cure times at lower temperatures for heat curing adhesives
- Formation of protective layers on certain metals which can reduce corrosion and metal migration
- One-part formulations are available with no need for meter-mixing before use
- A range of flow properties to suit application and process needs from self-leveling to non-flowing
- Color tinting for easy inspection and identification of separate components in two-part formulations
- Inclusion of spacer beads to maintain consistent bond line thickness
- UV dyes for easy inspection
- Enhanced thermal conductivity
- UL flammability and MIL Spec compliance
- Enhanced flame resistance
- Controlled volatility

Cure time

To find a product with the characteristics you want, check the Product Finder.

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  1. Adhesives and Sealants Tutorial


  2. Key Characteristics and Properties of Adhesives


  3. Adhesives and Sealants Tutorial - Bonding Mechanisms


  4. Adhesives and Sealants Applications


  5. Comparison of Product Families


  6. Basics of Processing Adhesives


  7. Adhesive Curing Methods


  8. Tell Us What You Need


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