Typical competitive options for adhesives and sealants are based on epoxy,
urethane or silicone polymers.
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Epoxy
Epoxy adhesives and sealants will bond to a variety of substrates. They can
cure at either room temperature or be accelerated with higher temperatures.
General-purpose epoxies have limited utility in long-term, high-temperature
service.
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Epoxy Chemical Structure |
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Urethane
Urethane adhesives and sealants will also bond to a variety of substrates and
offer a wide range of flexibility when cured. While their resistance to
chemicals, fuels and oils is excellent, they provide only average bond
strength to metal without the use of a primer.
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Urethane Chemical Structure |
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Silicone
Silicone adhesives and sealants are often used for their combination of
strength, durability and stress relief. Silicone adhesives and sealants from
Dow Corning are uniquely stable at high temperatures while remaining flexible
at low temperatures. They also offer excellent electrical properties and
resistance to weathering.
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Silicone Chemical Structure |
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Polyisobutylene (PIB)
Polyisobutylene (PIB) adhesives and sealants can bond to a variety of surfaces
and also offer a wide range of flexibility when cured. They have good low
temperature performance, but have relatively poor resistance to organic
solvents, fuels, oils and chemicals.
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Polyisobutylene Chemical Structure |
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Acrylic
Acrylic adhesives and sealants bond to a variety of (dry) substrates and are
normally cured at room temperature or with heat. Acrylics are typically one of
the lowest cost options, but have significant thermal and hydrolytic stability
limitations. They are normally used in electronics as Pressure Sensitive
Adhesives (PSAs).
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Acrylic Chemical Structure |
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Cyanoacrylate
Cyanoacrylates ("super glues" bond to a wide variety of surfaces to give a
very fast and strong bond. They have limited thermal stability, are brittle,
and can leave a white residue on nearby surfaces ("blooming"). Moisture
stability of the adhesion to metal can be poor.
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Cyanoacrylate Chemical Structure |
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