|
At first glance, it would seem important to choose the adhesive with the
highest strength. However, adhesives with these very high values are typically
also stiff materials with low elongation that are not able to absorb stress.
This can lead to the generation of very high forces in the electronic
assemblies upon heat excursions, thermal cycling or simply after long service
lives. These high stresses can result in damage to components or
interconnections that end in failure of the electronics.
In electronic uses, it is often better to utilize a material with good
intimate adhesion that will maintain its functionality for long times and in a
wide variety of extreme service environments. Silicone adhesives, with their
low modulus properties after curing, have been shown to do this very well.
The low modulus of the cured adhesives maintains a low stress environment on
the electronic assemblies that can significantly enhance the reliability of
the part.
|
Change
