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Applications-focused solutions built on the proven quality and performance of
the industry's best selling low-k spin-on dielectric (SOD). Choose from our
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| Type:
Inorganic Polymer
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Physical Form: As Supplied: Liquid solution of hydrogen silsesquioxane in carrier
solvent
As Processed: Spun-on flowable polymer cured to a
microporous amorphous film
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| Special Properties:
State-of-the-art planarization; low dielectric constant; controlled film
thickness; excellent gap fill; very low defect density; choice of carrier
solvent systems
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| Potential Uses:
Interlevel dielectric material in multilevel metal integrated circuit designs
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| Technical Data | Download Datasheet PDF |
Tutorial
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| Type:
Inorganic Polymer
|
Physical Form: As Supplied: Liquid solution in carrier solvent
As Processed
: Spun-on flowable polymer cured to a SiO2- like film
|
| Special Properties:
Void-free gap fill; controlled film thickness; very low defect density; low
metalic impurities; choice of carrier solvent systems
|
| Potential Uses:
Spin-on gap fill of shallow trench isolation structures at and below 65nm
technology nodes
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Technical Data
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Download Datasheet PDF
|
Tutorial
|
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