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Thermal Interface - Wet Dispensed


 
 
 
 
Advanced Packaging

Because of its rapid market acceptance just five months after its release, Dow Corning(R) TC-5022 has not only met our customers' expectations, but also caught the eye of some important industry experts - including Advanced Packaging, which featured the product in its July cover story. The magazine also gave the product its Best New Thermal Material Award.

 
2005 APA Award
2005 APA
 

This grease offers a step-change in thermal performance and cost of ownership for high-end microprocessor packages. According to customer testing, it offers up to 15 percent reduction in thermal resistance, improving thermal performance over other thermal grease options on the market today.

To learn more, we invite you to view the article from Advanced Packaging.

Best regards,
Phu Nguyen
Phu Nguyen
Market Manager, Thermal Management

 

 
Download Center
View our SemiTherm workshop paper on Thermally Conductive Greases.
Dow Corning(R) TC-5022 Qualified for use in AMD Microprocessor Packages
Wet dispensed Thermal Interface Materials
Thermal Interface Pads and Films
Dow Corning(R) Brand Thermally Conductive Materials Data Sheet

 
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