When markets demand smaller, faster, less expensive electronic devices and
assemblies, you respond. But smaller components, tighter lead spacing and
increased operating frequencies result in higher temperatures that can reduce
performance and reliability. Heat is the enemy of performance.
An emerging generation of Thermal Greases offer advantages in managing
thermal issues in advanced chips. A reprint of the cover story in the July
issue of Advanced Packaging is now available for viewing or download here
Conductivity in Advanced Chips.
Dow Corning can help you - Choose from a wide range of
ready-to-use thermal interface materials from Dow Corning Electronics
including: Adhesives, Gap
Fillers, Gels and Compounds we even supply Thermally Conductive Materials for Pad Manufacturing.
Challenge us to provide controlled ionic impurities grades or to formulate
completely new materials to meet your exact property and process needs.