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Thermal Interface - Wet Dispensed


When markets demand smaller, faster, less expensive electronic devices and assemblies, you respond. But smaller components, tighter lead spacing and increased operating frequencies result in higher temperatures that can reduce performance and reliability. Heat is the enemy of performance.

An emerging generation of Thermal Greases offer advantages in managing thermal issues in advanced chips. A reprint of the cover story in the July issue of Advanced Packaging is now available for viewing or download here -  Thermal Conductivity in Advanced Chips.

Dow Corning can help you - Choose from a wide range of ready-to-use thermal interface materials from Dow Corning Electronics including: Adhesives,  Gap Fillers,  Gels and Compounds we even supply Thermally Conductive Materials for Pad Manufacturing
Challenge us to provide controlled ionic impurities grades or to formulate completely new materials to meet your exact property and process needs.

Learn more from the Thermally Conductive Materials Tutorial.

For information about our newest product, Dow Corning® brand DA-6534 Adhesive, click here.

Thermal White Papers

Dispensable Thermal Pads
Want to increase thermal performance and lower system costs for your electronics application?
Find out how
Relative Properties of Thermal Interface Materials

Relative Properties of Thermal Interface Materials
Process and Performance Needs and Thermal Interface Materials benefits

Process and performance needs and TIM benefits
Needs Addressed by Thermal Interface Materials

Needs addressed by Thermal Interface Materials

Not exactly sure what product form you need? Connect here to our interactive Product finder for this family of materials.

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help.

Link to the Overview of:  Thermally Conductive Adhesives
Type: One or two-part silicone elastomer
Physical Form: Nonflowable and flowable options; cures to flexible elastomer
Special Properties: Fast thermal cure, or RTV cure available; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress; noncorrosive
Potential Uses: Bonding hybrid integrated circuit substrates; heat sink attach; potting power supplies
Technical DataTutorial

Link to the Overview of:  Gap filling Thermally Conductive Encapsulants
Type: Two-part silicone elastomer
Physical Form: Flowable liquid; cures to flexible elastomer
Special Properties: Constant cure rate, regardless of sectional thickness or degree of confinement; no post-cure required
Potential Uses: Potting of high-voltage transformers and sensors; assembly of substrates to heat sinks; gap fill material between heat sources and heat sinks
Technical DataTutorial

Link to the Overview of:  Thermally Conductive Gels
Type: Two-part silicone gel
Physical Form: Low to moderate viscosity; cures to gel like material
Special Properties: Long working times, fast thermal cure; resists humidity and other harsh environments; good dielectric properties; self-priming adhesion; low stress; non-corrosive
Potential Uses: Gap fill material between electronic heat sources and heat sinks
Technical DataTutorial

Link to the Overview of:  Thermally Conductive Compounds
Type: Non-curing, thermally conductive silicone paste
Special Properties: High thermal conductivity; low bleed; high-temperature stability
Potential Uses: Gap fill material between heat sources and heat sinks
Technical DataTutorial

Link to the Overview of:  Thermally Conductive Materials for Pad Manufacturing
Type: Two-part heat cure
Special Properties: Soft, good thermal conductivity, low viscosity
Potential Uses: Base material for thermally conductive pads
Technical DataTutorial

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