Silicones from Dow CorningWe help you invent the future.
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Electronics Solutions
Product Resources
Applications
Technical Resources

Thermal Interface - Wet Dispensed


Electronics Modules - Heat Sink Attach


For Heat Sink Attach, select one of Dow Corning's Thermally Conductive Adhesives. Here are some items for considerations in choosing the appropriate material for your use:

  • For more demanding applications, you will likely want to select a product from this family of thermally conductive adhesives with higher conductivity values. For applications needing less heat dissipation, you may also want to consider other adhesive/sealants with moderate conductivity values.
  • For heat-curing adhesives, cure times typically are shorter with increasing temperatures.
  • One-part materials are easier to handle, two-part materials often offer faster processing. Two-part materials are typically 1:1 mix ratio.
  • A number of these products have UL or Mil Spec approvals.

 

Additional Information

Adhesive/Sealant Product Information

Thermally Conductive Adhesive Product Information

Adhesives/Sealants Tutorial

Thermally Conductive Materials Tutorial

< back to Thermal Interface - Wet Dispensed Home Page  
Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2013 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.