Thermal Interface - Wet Dispensed

Thermally Conductive Adhesives Overview

Dow Corning® offers a variety of noncorrosive, thermally conductive silicone adhesives that are ideally suited for use in bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are major concerns. The flowable versions are also ideal for use as thermally conductive potting materials for transformers, power supplies, coils and other electronic devices that require improved thermal dissipation. 

	Dow Corning® Brand Product		Description		Features
	SE4420 Thermally Conductive Adhesive		One-part moisture cure		Flowable with moderate thermal conductivity; fast tack-free
	SE4422 Thermally Conductive Adhesive		One-part moisture cure		High viscosity with moderate thermal conductivity; UL 94 V-1 rating; fast tack-free
	SE4486 CV Thermally Conductive Adhesive		Flowable; one-part moisture cure		Flowable with good thermal conductivity and controlled volatility (D4-D10 < 0.002); fast tack-free
	SE9184 CV Thermally Conductive Adhesive		One-part; non-flow; moisture cure		Moderate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free
	SE4400 Thermally Conductive Adhesive		Two-part; semi-flowable		Long pot life; rapid heat cure; self-priming
	SE4402 CV Thermally Conductive Adhesive		One-part; gray; heat cure		Moderate thermal conductivity; controlled volatility
	SE4450 Thermally Conductive Adhesive		One-part; gray; heat cure		High thermal conductivity
	1-4173 Thermally Conductive Adhesive		One-part; low flow; gray		Rapid heat cure; high thermal conductivity
	1-4174 Thermally Conductive Adhesive		One-part; low flow; gray		Rapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control
	Q1-9226 Thermally Conductive Adhesive		Two-part; semi-flowable		Long pot life; rapid heat cure; self-priming
	3-1818 Thermally Conductive Adhesive		One-part; gray		Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; UL 94 V-0 rating; contains 7-mil (178 micron) glass beads for bond line control
	Q3-3600 Thermally Conductive Encapsulant		Two-part; gray; 1:1		Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating
	3-6605 Thermally Conductive Elastomer		Two-part; gray; 1:1; medium viscosity; heat cure		Good flowability
	3-6751 Thermally Conductive Adhesive		Two-part; gray		Low modulus; low viscosity; heat curable; UL94 V-0 rating
	3-6752 Thermally Conductive Adhesive		One-part; gray		Rapid heat cure and primerless adhesion to common substrates used in the electronics industry; UL 94 V-0 rating
	3-6753 Thermally Conductive Adhesive		Two-part; gray; heat cure		Low modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control

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