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Thermal Interface - Wet Dispensed


Thermally Conductive Adhesives Overview


Dow Corning® offers a variety of noncorrosive, thermally conductive silicone adhesives that are ideally suited for use in bonding hybrid circuit substrates, power semiconductor components and devices to heat sinks as well as for use in other bonding applications where flexibility and thermal conductivity are major concerns. The flowable versions are also ideal for use as thermally conductive potting materials for transformers, power supplies, coils and other electronic devices that require improved thermal dissipation. 

Dow Corning® Brand ProductDescriptionFeatures
SE4420 Thermally Conductive AdhesiveOne-part moisture cureFlowable with moderate thermal conductivity; fast tack-free
SE4422 Thermally Conductive AdhesiveOne-part moisture cureHigh viscosity with moderate thermal conductivity; UL 94 V-1 rating; fast tack-free
SE4486 CV Thermally Conductive AdhesiveFlowable; one-part moisture cureFlowable with good thermal conductivity and controlled volatility (D4-D10 < 0.002); fast tack-free
SE9184 CV Thermally Conductive AdhesiveOne-part; non-flow; moisture cureModerate thermal conductivity; UL 94 V-0 rating; controlled volatility (D4-D10 0.003); fast tack-free
SE4400 Thermally Conductive AdhesiveTwo-part; semi-flowableLong pot life; rapid heat cure; self-priming
SE4402 CV Thermally Conductive AdhesiveOne-part; gray; heat cureModerate thermal conductivity; controlled volatility
SE4450 Thermally Conductive AdhesiveOne-part; gray; heat cureHigh thermal conductivity
1-4173 Thermally Conductive AdhesiveOne-part; low flow; grayRapid heat cure; high thermal conductivity

1-4174 Thermally Conductive Adhesive

One-part; low flow; grayRapid heat cure; high thermal conductivity; contains 7-mil (178-micron) glass beads for bond line control
Q1-9226 Thermally Conductive AdhesiveTwo-part; semi-flowableLong pot life; rapid heat cure; self-priming
3-1818 Thermally Conductive AdhesiveOne-part; grayRapid heat cure and primerless adhesion to common substrates used in the electronics industry; UL 94 V-0 rating; contains 7-mil (178 micron) glass beads for bond line control
Q3-3600 Thermally Conductive EncapsulantTwo-part; gray; 1:1Rapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating
3-6605 Thermally Conductive ElastomerTwo-part; gray; 1:1; medium viscosity; heat cureGood flowability
3-6751 Thermally Conductive AdhesiveTwo-part; grayLow modulus; low viscosity; heat curable; UL94 V-0 rating
3-6752 Thermally Conductive AdhesiveOne-part; grayRapid heat cure and primerless adhesion to common substrates used in the electronics industry; UL 94 V-0 rating
3-6753 Thermally Conductive AdhesiveTwo-part; gray; heat cureLow modulus; low viscosity; contains 7-mil (178 micron) glass beads for bond line control

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