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Thermal Interface - Wet Dispensed


Thermally Conductive Compounds Overview


 

Dow Corning® Brand ProductDescriptionFeaturesPotential Uses
SC102 Thermally Conductive CompoundNon-curing, thermally conductive silicone compoundModerate thermal conductivity; low bleed; stable at high temperatures. Low thermal resistance at thin bondlines.Interface material between electronic heat sources and heat sinks
SE4490CV Thermally Conductive CompoundNon-curing, thermally conductive silicone compoundHigh thermal conductivity; low bleed; stable at high temperatures. Controlled volatility grade.Interface material between electronic heat sources and heat sinks
340 Heat Sink CompoundNon-curing, thermally conductive silicone compoundLow bleed; stable at high temperatures.Interface material between electronic heat sources and heat sinks
TC-5022 Thermally Conductive Compound (PDF size = 280KB)Non-curing, thermally conductive silicone compoundLow thermal resistance; Capable of ultra-thin bond lines. Solvent free. High reliability & stability. No dry out formulation.Thermal interface for electronic components including; CPUs, LED, hybrid inverters, DLP chips and more.
TC-5121 Thermally Conductive Compound (PDF size = 264KB)Non-curing, thermally conductive silicone compoundLow thermal resistance; medium thermal conductivity. Low cost.Thermal interface for a variety of medium power components such as CPUs, LED, etc.
TC-2030 Thermally Conductive Compound (PDF size = 321KB)Two-part, heat cured thermally conductive adhesiveSolvent Free. Thermal conductivity: 2.7W/mK. High reliability & stability. Thixotropic for accurate needle dispense. Adhesion to various substrates.Thermal interface material for a variety of electronic devices including Lid sealant, LED, Under hood automotive electronics, Power steering, anti lock braking and electronic stability control modules.

 

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