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| SC102 Thermally Conductive Compound | | Non-curing, thermally conductive silicone compound | | Moderate thermal conductivity; low bleed; stable at high
temperatures. Low thermal resistance at thin bondlines. | | Interface material between electronic heat sources and heat
sinks | |
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| SE4490CV Thermally Conductive Compound | | Non-curing, thermally conductive silicone compound | | High thermal conductivity; low bleed; stable at high
temperatures. Controlled volatility grade. | | Interface material between electronic heat sources and heat
sinks | |
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| 340 Heat Sink Compound | | Non-curing, thermally conductive silicone compound | | Low bleed; stable at high temperatures. | | Interface material between electronic heat sources and heat
sinks | |
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| TC-5026
Thermally Conductive Compound (PDF size = 320KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; Capable of ultra-thin bond lines.
Solvent free. High reliability & stability. No dry out formulation. | | Thermal interface for electronic components including; CPUs,
LED, hybrid inverters, DLP chips and more | |
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| TC-5022
Thermally Conductive Compound (PDF size = 280KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; Capable of ultra-thin bond lines.
Solvent free. High reliability & stability. No dry out formulation. | | Thermal interface for electronic components including; CPUs,
LED, hybrid inverters, DLP chips and more. | |
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| TC-5121
Thermally Conductive Compound (PDF size = 264KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; medium thermal conductivity. Low
cost. | | Thermal interface for a variety of medium power components such
as CPUs, LED, etc. | |
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| TC-2030
Thermally Conductive Compound (PDF size = 321KB) | | Two-part, heat cured thermally conductive adhesive | | Solvent Free. Thermal conductivity: 2.7W/mK. High
reliability & stability. Thixotropic for accurate needle dispense.
Adhesion to various substrates. | | Thermal interface material for a variety of electronic devices
including Lid sealant, LED, Under hood automotive electronics, Power steering,
anti lock braking and electronic stability control modules. | |
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PDF Links will download files in Adobe Acrobat PDF format. For technical
information, or to download the free Acrobat Reader, go to Acrobat help.
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