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| SC102 Thermally Conductive Compound | | Non-curing, thermally conductive silicone compound | | Moderate thermal conductivity; low bleed; stable at high
temperatures. Low thermal resistance at thin bondlines. | | Interface material between electronic heat sources and heat
sinks | |
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| SE4490CV Thermally Conductive Compound | | Non-curing, thermally conductive silicone compound | | High thermal conductivity; low bleed; stable at high
temperatures. Controlled volatility grade. | | Interface material between electronic heat sources and heat
sinks | |
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| 340 Heat Sink Compound | | Non-curing, thermally conductive silicone compound | | Low bleed; stable at high temperatures. | | Interface material between electronic heat sources and heat
sinks | |
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| TC-5026
Thermally Conductive Compound (PDF size = 259KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; Capable of ultra-thin bond lines.
Solvent free. High reliability & stability. No dry out formulation. | | Thermal interface for electronic components including; CPUs,
LED, hybrid inverters, DLP chips and more | |
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| TC-5022
Thermally Conductive Compound (PDF size = 247KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; Capable of ultra-thin bond lines.
Solvent free. High reliability & stability. No dry out formulation. | | Thermal interface for electronic components including; CPUs,
LED, hybrid inverters, DLP chips and more. | |
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| TC-5121
Thermally Conductive Compound (PDF size = 229KB) | | Non-curing, thermally conductive silicone compound | | Low thermal resistance; medium thermal conductivity. Low
cost. | | Thermal interface for a variety of medium power components such
as CPUs, LED, etc. | |
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| TC-5688
Thermally Conductive Compound (PDF size = 198KB) | | Non-curing, thermally conductive silicone compound | | Very high thermal conductivity. Low thermal resistance.
Optimized for multi-chip packages. Resists pump-out. | | Thermal interface for electronic components including; bare die
processors, laptop CPUs, MCPs and other applications with multiple substrates
covered by one heat sink. | |
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information, or to download the free Acrobat Reader, go to Acrobat help.
