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Thermal Interface - Wet Dispensed


Thermally Conductive Encapsulants Overview


Dow Corning® thermally conductive silicone encapsulants are supplied as two-part liquid component kits. When the liquid components are thoroughly mixed, the mixture cures to a flexible elastomer, suitable for the protection of electrical/electronic applications where heat dissipation is critical. These elastomers cure without exotherm at a constant rate regardless of sectional thickness or degree of confinement. Dow Corning thermally conductive elastomers require no post-cure and can be placed in service immediately at operating temperatures of -45 to 200°C (-49 to 392°F) following the completion of the cure schedule.

 

Dow Corning® Brand ProductDescriptionFeatures
SE4410 Thermally Conductive EncapsulantTwo-part; low viscosityHeat cure; moderate thermal conductivity; UL 94 V-0 rating
SE4447 CV Thermally Conductive EncapsulantTwo-part; grayExcellent thermal conductivity; low volatility; excellent high temperature stability and low temperature resistance
SE4448 CV Thermally Conductive EncapsulantTwo-part; grayExcellent thermal conductivity; low volatility (D4-D10 0.03% wt); heat cure; high viscosity
Q3-3600 Thermally Conductive EncapsulantTwo-part; grayRapid heat cure; long pot life; excellent flow; self-priming; UL 94 V-1 rating
3-6651 Thermally Conductive EncapsulantTwo-part; grayLow modulus; low viscoisty; good thermal conducitivity; UL 94 V-0 rating
3-6652 Thermally Conductive EncapsulantTwo-part; grayLow modulus; thixotropic; good thermal conductivity
3-6655 Thermally Conductive EncapsulantTwo-part; grayLow viscosity; soft; excellent thermal conductivity; UL 94 V-0

 

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