Dow Corning® Fabricated Film and Pads are supplied ready to use for those
who would rather not utilize curing processes. They are cold-applied with
no need for special tools and equipment. They can be supplied in roll form
as well as in pre-stamped shapes specific for your application. They are
easily removed and reworked when
needed.
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Thin Thermal Interface Materials
These pre-cured films or pads are based on thermally conductive gels or
elastomers. They are available with or without fiberglass
reinforcement. The fiberglass adds strength and improved handle-ability to
the films as well as providing for a minimum stand-off when highly compressed.
Different versions are supplied with tack on either one or both
sides. Some have enhanced flame resistance.
All versions of the thin thermal interface materials provide low thermal
resistance values. They are supplied in custom stamped shapes or as
unstamped sheets and rolls (0.25-2.00 mm/0.010-0.079 inches thick).
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Gap Filler Interface Materials
These pre-cured films or pads are based on thermally conductive gels. Some
of the softer versions are reinforced with foam matrix for improved
handle-ability. Different versions are supplied with tack on either one or both
sides. They generally are handled and have similar characteristics to the
thin thermal interface materials above, but are supplied in greater thickness
for larger offset between the heat sink and source, as well as to provide
greater stress relief for delicate circuitry. Gap Filler Interface
Materials are supplied on rolls as custom stamped shapes or as unstamped rolls
(2.2-4.6 mm/0.090-0.18 inches thick).
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Phase Change Interface Materials
Phase Change Interface Materials will melt at temperatures slightly above
50°C. They can be either organic or silicone based. All of the phase
change materials have very low mounting forces with excellent wet out and
surface contact. This results in very low thermal resistance
values. They are supplied unsupported or on polyimide or aluminum
carriers.
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