Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Continue
Silicones from Dow Corning
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers

Thermal Interface - Wet Dispensed


<  1  3  4  5  6  7  8  9  >
Types of Fabricated Films and Pad Thermal Interface Materials

Dow Corning® Fabricated Film and Pads are supplied ready to use for those who would rather not utilize curing processes. They are cold-applied with no need for special tools and equipment. They can be supplied in roll form as well as in pre-stamped shapes specific for your application. They are easily removed and reworked when needed.

Thin Thermal Interface Materials

These pre-cured films or pads are based on thermally conductive gels or elastomers. They are available with or without fiberglass reinforcement. The fiberglass adds strength and improved handle-ability to the films as well as providing for a minimum stand-off when highly compressed. Different versions are supplied with tack on either one or both sides. Some have enhanced flame resistance.

All versions of the thin thermal interface materials provide low thermal resistance values. They are supplied in custom stamped shapes or as unstamped sheets and rolls (0.25-2.00 mm/0.010-0.079 inches thick). 

Gap Filler Interface Materials

These pre-cured films or pads are based on thermally conductive gels. Some of the softer versions are reinforced with foam matrix for improved handle-ability. Different versions are supplied with tack on either one or both sides. They generally are handled and have similar characteristics to the thin thermal interface materials above, but are supplied in greater thickness for larger offset between the heat sink and source, as well as to provide greater stress relief for delicate circuitry. Gap Filler Interface Materials are supplied on rolls as custom stamped shapes or as unstamped rolls (2.2-4.6 mm/0.090-0.18 inches thick).

Phase Change Interface Materials

Phase Change Interface Materials will melt at temperatures slightly above 50°C. They can be either organic or silicone based. All of the phase change materials have very low mounting forces with excellent wet out and surface contact. This results in very low thermal resistance values. They are supplied unsupported or on polyimide or aluminum carriers.

<  1  3  4  5  6  7  8  9  >

 
  1. Thermal Interface Materials Tutorial


  2. Why is Heat Bad for Electronic Devices?


  3. Types of Wet Dispensed Thermal Interface Materials


  4. Types of Fabricated Films and Pad Thermal Interface Materials


  5. Key Characteristics – Wet Dispensed Thermal Interface Materials


  6. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  7. Potential Applications for Thermal Interface Materials


  8. Testing considerations


Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2017 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company.
The Corning portion of the Dow Corning trademark is a trademark of Corning Incorporated, used under license. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.®™Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow.
Dow Corning complies with the California Transparency in Supply Chains Act.