Generally, all of the thermal interface materials supplied by Dow Corning
are non-corrosive with good thermal conductivity values as well as high
dielectric insulation. They maintain a low stress environment for the
electronics while withstanding humidity and other harsh environments.
For choosing the best material for heat dissipation, their thermal
properties will be important factors. However, other factors such as ease
of application, the need for curing etc. will also be important in choosing the
best material for your use.
Other key characteristics of the various types of wet dispensed thermal
interface materials are given
below:
|
Non-curing Compounds
• No mixing or curing is required, applied with simple dispensing or
printing processes
• Allows very thin bond lines using minimal pressures
• Intimate surface contact can result in low interfacial resistance
• Generally used along with mechanical fasteners to prevent movement
• Allows for rework
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 |
Adhesives
• Both one-part and two-part formulations with heat or moisture cure
mechanisms are available
• Wide variety of formulations from flowable liquids to non-flowing
pastes
• Wide variety of cure speeds suitable for various process needs
• Eliminates a need for mechanical fasteners
• Intimate surface contact can result in low interfacial resistance
• Some formulations contain spacer beads for easily achieving uniform
bondlines
|
|
Encapsulants
• Generally supplied as two-part formulations
• Cure in any thickness
• Can be cured quickly with heat without the need for post-curing
• Alternative to pre-cured pads
• Higher mechanical strength values as compared to gels
|  |
 |
Gels
• Generally supplied as two-part formulations
• Provides the ultimate in stress relief in a cured material
• Useful in protecting fragile components
• Easily compensates for irregular surfaces and high tolerances with minimal
compression
• Mimics compounds or thermal greases but in a cured material
• Low interfacial contact resistance
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To find a wet dispensed thermally conductive product with the
characteristics you want, check the Product
Finder.
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