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Thermal Interface - Wet Dispensed


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Key Characteristics – Wet Dispensed Thermal Interface Materials

Generally, all of the thermal interface materials supplied by Dow Corning are non-corrosive with good thermal conductivity values as well as high dielectric insulation. They maintain a low stress environment for the electronics while withstanding humidity and other harsh environments.

For choosing the best material for heat dissipation, their thermal properties will be important factors. However, other factors such as ease of application, the need for curing etc. will also be important in choosing the best material for your use. 

Other key characteristics of the various types of wet dispensed thermal interface materials are given below: 

Non-curing Compounds

• No mixing or curing is required, applied with simple dispensing or printing processes

• Allows very thin bond lines using minimal pressures

• Intimate surface contact can result in low interfacial resistance

• Generally used along with mechanical fasteners to prevent movement

• Allows for rework

Adhesives

• Both one-part and two-part formulations with heat or moisture cure mechanisms are available

• Wide variety of formulations from flowable liquids to non-flowing pastes

• Wide variety of cure speeds suitable for various process needs

• Eliminates a need for mechanical fasteners

• Intimate surface contact can result in low interfacial resistance

• Some formulations contain spacer beads for easily achieving uniform bondlines

Encapsulants

• Generally supplied as two-part formulations

• Cure in any thickness

• Can be cured quickly with heat without the need for post-curing

• Alternative to pre-cured pads

• Higher mechanical strength values as compared to gels

Gels

• Generally supplied as two-part formulations

• Provides the ultimate in stress relief in a cured material

• Useful in protecting fragile components

• Easily compensates for irregular surfaces and high tolerances with minimal compression

• Mimics compounds or thermal greases but in a cured material

• Low interfacial contact resistance

To find a wet dispensed thermally conductive product with the characteristics you want, check the Product Finder.

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< back to Thermal Interface - Wet Dispensed Home Page  
 
  1. Thermal Interface Materials Tutorial


  2. You Don't Have To Do It Alone!


  3. Why is Heat Bad for Electronic Devices?


  4. Types of Wet Dispensed Thermal Interface Materials


  5. Types of Fabricated Films and Pad Thermal Interface Materials


  6. Key Characteristics – Wet Dispensed Thermal Interface Materials


  7. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  8. Potential Applications for Thermal Interface Materials


  9. Testing considerations


  10. Specialty Materials


  11. Basics of Processing for Wet Dispensed Thermal Interface Materials


  12. Curing of Wet Dispensed Thermal Interface Materials


  13. Basics of Processing for Fabricated Films and Pads


  14. Packaging and Storage Considerations


  15. Tell Us What You Need


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