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Key Characteristics – Fabricated Pad and Film Thermal Interface Materials

Dow Corning® Fabricated Films and Pads are supplied ready to use for those who want to avoid curing processes. They are cold-applied with no need for special tools and equipment. They are easily removed and reworked when needed.

Other key characteristics of the various types of thermal interface materials are given below:

Thin Thermal Interface Materials

• Based on silicone gels reinforced with or without a fiberglass fabric or on silicone elastomers

• Fiberglass supplies added strength as well as providing for a minimum stand-off thickness and protection from metal burs

• Reduces stress even with relatively high compression to accommodate uneven surfaces

• Easy application without need for dispensing and curing

• Can be easily reworked

Gap Filler Interface Materials

• Based on silicone gels with an optional foam matrix

• Supplied in a range of thickness and hardness options

• Accommodates large gaps and irregular surfaces using minimal pressures

• Easy application without need for dispensing and curing

• Can be easily reworked

Phase Change Interface Materials

• Silicone and organic-based versions available

• Dry, non-tacky surfaces

• Can achieve complete wet-out of surfaces after a mild melt temperature

• Very thin bond lines

• Accommodates irregular surfaces

• Very low mounting force

• Low thermal resistance

To find a thermally conductive pad or film product with the characteristics you want, check the Product Finder

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  1. Thermal Interface Materials Tutorial


  2. Why is Heat Bad for Electronic Devices?


  3. Types of Wet Dispensed Thermal Interface Materials


  4. Types of Fabricated Films and Pad Thermal Interface Materials


  5. Key Characteristics – Wet Dispensed Thermal Interface Materials


  6. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  7. Potential Applications for Thermal Interface Materials


  8. Testing considerations


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