Dow Corning® Fabricated Films and Pads are supplied ready to use for those
who want to avoid curing processes. They are cold-applied with no need for
special tools and equipment. They are easily removed and reworked when
needed.
Other key characteristics of the various types of thermal interface
materials are given below:
 |
Thin Thermal Interface Materials
• Based on silicone gels reinforced with or without a fiberglass fabric or
on silicone elastomers
• Fiberglass supplies added strength as well as providing for a minimum
stand-off thickness and protection from metal burs
• Reduces stress even with relatively high compression to accommodate uneven
surfaces
• Easy application without need for dispensing and curing
• Can be easily reworked
|
|
Gap Filler Interface Materials
• Based on silicone gels with an optional foam matrix
• Supplied in a range of thickness and hardness options
• Accommodates large gaps and irregular surfaces using minimal pressures
• Easy application without need for dispensing and curing
• Can be easily reworked
|
 |
 |
Phase Change Interface Materials
• Silicone and organic-based versions available
• Dry, non-tacky surfaces
• Can achieve complete wet-out of surfaces after a mild melt temperature
• Very thin bond lines
• Accommodates irregular surfaces
• Very low mounting force
• Low thermal resistance
|
To find a thermally conductive pad or film product with the
characteristics you want, check the Product
Finder.
Change
