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Thermal Interface - Wet Dispensed

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Potential Applications for Thermal Interface Materials

Heat dissipation is a critical consideration in package design at all levels of electronics from individual chip surfaces to electronic boards and modules. Thermal interface materials are used to couple the electronics to heat sinks, fan sinks or heat pipe assemblies. They can also couple to package lids, baseplates or heat spreaders. Thus, thermal interface materials can be considered for use in such wide-ranging applications as:

  • CPU’s and microprocessors
  • Flip chip IC interfaces to package lids
  • Power semiconductors and modules
  • Optical components such as laser diodes, multiplexers and transceivers
  • Sensors
  • Power supplies
  • High speed mass storage drives
  • Motor controls
  • High voltage transformers
  • Automotive mechatronics



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  1. Thermal Interface Materials Tutorial

  2. Why is Heat Bad for Electronic Devices?

  3. Types of Wet Dispensed Thermal Interface Materials

  4. Types of Fabricated Films and Pad Thermal Interface Materials

  5. Key Characteristics – Wet Dispensed Thermal Interface Materials

  6. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials

  7. Potential Applications for Thermal Interface Materials

  8. Testing considerations

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