Heat dissipation is a critical consideration in package design at all levels
of electronics from individual chip surfaces to electronic boards and modules.
Thermal interface materials are used to couple the electronics to heat sinks,
fan sinks or heat pipe assemblies. They can also couple to package lids,
baseplates or heat spreaders. Thus, thermal interface materials can be
considered for use in such wide-ranging applications
as:
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CPU’s and microprocessors
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Flip chip IC interfaces to package lids
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Power semiconductors and modules
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Optical components such as laser diodes, multiplexers and transceivers
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Sensors
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Power supplies
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High speed mass storage drives
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Motor controls
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High voltage transformers
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Automotive mechatronics
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