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Thermal Interface - Wet Dispensed


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Potential Applications for Thermal Interface Materials

Heat dissipation is a critical consideration in package design at all levels of electronics from individual chip surfaces to electronic boards and modules. Thermal interface materials are used to couple the electronics to heat sinks, fan sinks or heat pipe assemblies. They can also couple to package lids, baseplates or heat spreaders. Thus, thermal interface materials can be considered for use in such wide-ranging applications as:

  • CPU’s and microprocessors
  • Flip chip IC interfaces to package lids
  • Power semiconductors and modules
  • Optical components such as laser diodes, multiplexers and transceivers
  • Sensors
  • Power supplies
  • High speed mass storage drives
  • Motor controls
  • High voltage transformers
  • Automotive mechatronics

 

 

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< back to Thermal Interface - Wet Dispensed Home Page  
 
  1. Thermal Interface Materials Tutorial


  2. You Don't Have To Do It Alone!


  3. Why is Heat Bad for Electronic Devices?


  4. Types of Wet Dispensed Thermal Interface Materials


  5. Types of Fabricated Films and Pad Thermal Interface Materials


  6. Key Characteristics – Wet Dispensed Thermal Interface Materials


  7. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  8. Potential Applications for Thermal Interface Materials


  9. Testing considerations


  10. Specialty Materials


  11. Basics of Processing for Wet Dispensed Thermal Interface Materials


  12. Curing of Wet Dispensed Thermal Interface Materials


  13. Basics of Processing for Fabricated Films and Pads


  14. Packaging and Storage Considerations


  15. Tell Us What You Need


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