Certain applications are uniquely demanding and require specialized
properties of thermally conductive
materials.
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Low or Controlled Volatility Materials
In some applications, low molecular weight volatiles from thermally
conductive materials can result in problems. This can range from volatiles
re-condensing onto surfaces that negatively impact adhesion or fogging optical
sensors or can lead to decomposition of volatiles under high voltage or high
temperature conditions. For these cases, special low volatility
intermediates are used to formulate Dow Corning’s low volatility
products.
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Flame Resistance
The materials used in certain applications are required to meet special
criteria such as those from Underwriters Laboratories for
flammability. There are thermally conductive materials, which possess a UL
94V or HB flammability classification.
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Controlled Bondline Thickness Materials
In some applications it is necessary to maintain a specific bondline
thickness to avoid components being misaligned or to avoid squeezing all the
material out of a joint if too much pressure is applied when placing a device
onto a substrate. For these applications Dow Corning can supply thermally
conductive materials containing rigid spacer beads.
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