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Thermal Interface - Wet Dispensed


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Basics of Processing for Wet Dispensed Thermal Interface Materials

Dow Corning® Thermal Interface Materials are supplied as dispensable liquids and pastes or as fabricated films and pads that are easily applied by a variety of methods. Liquids or pastes are typically applied using automated needle dispense systems or by stencil/screen printing. 
Liquid products supplied in one part form are generally ready for dispensing as is. Two part formulations, however, require mixing. Automated meter/mix equipment is available for this purpose. 
Hand mixing with manual dispensing or using hand-held mixing/dispense devices may also be used in low volume processes. In automated equipment, the two components are drawn from their individual containers or from storage reservoirs to a metering device which measures out the appropriate quantities of each part, dictated by shot size and mix ratio of the product (either 1:1 or 10:1 mix ratios). The two parts are then combined and moved through a static mixer. When properly sized for the viscosity and flow rate of the material being applied, the two parts are blended uniformly and without the incorporation of air. After mixing, the two part products can now be handled similarly to one parts and can be dispensed by one of the two methods described below. 

Also, during normal storage, filler separation may occur in some of the materials. The filler particles, used in some formulations, are dense enough that gravity can cause them to settle over time, leaving a clear polymer layer on top. The longer the material is stored, the more likely some filler separation will occur. In some cases, it may be necessary to re-mix the material before being used in your application and it may be helpful to have a gentle agitation system in the feed reservoirs to keep the fillers uniform.  Care should be taken to avoid introducing air into the product when re-mixing the filler.

For assistance in designing a process tailored to the needs of your application, contact Dow Corning’s technical experts in the Application Center.

Needle Dispense

Liquid thermally conductive materials are typically moved through the dispensing equipment from their original container or material reservoir using pumps or other mechanical force. Sometimes, gas pressure on the backside of a plunger or pressure plate is used to control the amount of material being applied.  If gas pressure is used, a barrier is needed to separate to the gas from the material to reduce bubbles in the cured adhesive. A precision metering pump is typically used when small amounts of material are being applied to control the amount of material dispensed, while a valve may be used when dispensing larger quantities of material. For high production rate processes, the pattern of application can be robotically controlled. The dispense head moves to allow the material to be applied in the desired configuration. Alternatively, multiple needles or slits in the dispense head can apply the desired pattern.

Stencil/Screen printing

Dow Corning Thermal Interface Materials that are liquids can also be stencil or screen printed onto substrates, which can be done reliably and quickly. Using stencils or screens allows the material to be placed onto the device only in the areas needed and in the amount required for the application.  Stencils are typically made of stainless steel with openings cut where the material is to be applied. The material is applied to the top of the stencil and a squeegee is drawn across pushing the material through the stencil openings and onto the substrate. A fixture is typically used to hold the substrate and maintain uniform positioning.

Several factors affect the quality of the print including snap-off distance, stencil thickness, squeegee speed and down force, etc. It is important to keep the stencil clean of debris and cured adhesive to ensure print quality. Wear on the squeegee blade can also cause problems, as it will create uneven pressure on the adhesive as it is applied.

Screen printing is very similar except that material is printed through a patterned mesh (screen) rather than openings cut into a stencil.

 

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< back to Thermal Interface - Wet Dispensed Home Page  
 
  1. Thermal Interface Materials Tutorial


  2. You Don't Have To Do It Alone!


  3. Why is Heat Bad for Electronic Devices?


  4. Types of Wet Dispensed Thermal Interface Materials


  5. Types of Fabricated Films and Pad Thermal Interface Materials


  6. Key Characteristics – Wet Dispensed Thermal Interface Materials


  7. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  8. Potential Applications for Thermal Interface Materials


  9. Testing considerations


  10. Specialty Materials


  11. Basics of Processing for Wet Dispensed Thermal Interface Materials


  12. Curing of Wet Dispensed Thermal Interface Materials


  13. Basics of Processing for Fabricated Films and Pads


  14. Packaging and Storage Considerations


  15. Tell Us What You Need


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