Silicones from Dow CorningWe help you invent the future.
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Home > Technical Library > Electronics > Thermal Interface - Wet Dispensed
Electronics Products
Electronics Solutions
Product Resources
Applications
Technical Resources

Thermal Interface - Wet Dispensed


 <  1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  >
Basics of Processing for Fabricated Films and Pads

Dow Corning® Fabricated Film and Pad Thermal Interface Materials can be supplied in two basic forms, rolls or pre-cut shapes. Rolls are supplied in specified widths and thickness. The processing equipment then needs to have the capability of cutting (stamping) the shape required for your application. After stamping, the material is applied manually or by using pick-and-place equipment. Dow Corning can also supply pads already cut to your specified shape, eliminating any need for a stamping process. 

Dow Corning® Thin Thermal and Gap Filler Thermal Interface Materials are supplied ready to use and are applied at room temperature without the need for heating. The release liner is simply removed from one side of the film and the film is applied to the substrate. 

Dow Corning® Phase Change Thermal Interface Materials are solid when applied at room temperature. When heated above 50°C the material becomes a liquid. When cooled to room temperature, it resolidifies. Mechanical clamping is required to hold assemblies in place.

For assistance in designing a process tailored to the needs of your application, contact Dow Corning’s technical experts in the Application Center.
<  1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  >

< back to Thermal Interface - Wet Dispensed Home Page  
 
  1. Thermal Interface Materials Tutorial


  2. You Don't Have To Do It Alone!


  3. Why is Heat Bad for Electronic Devices?


  4. Types of Wet Dispensed Thermal Interface Materials


  5. Types of Fabricated Films and Pad Thermal Interface Materials


  6. Key Characteristics – Wet Dispensed Thermal Interface Materials


  7. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials


  8. Potential Applications for Thermal Interface Materials


  9. Testing considerations


  10. Specialty Materials


  11. Basics of Processing for Wet Dispensed Thermal Interface Materials


  12. Curing of Wet Dispensed Thermal Interface Materials


  13. Basics of Processing for Fabricated Films and Pads


  14. Packaging and Storage Considerations


  15. Tell Us What You Need
Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2013 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.