Dow Corning® Thin Thermal and Gap Filler Thermal Interface Materials are
supplied ready to use and are applied at room temperature without the need for
heating. The release liner is simply removed from one side of the film and
the film is applied to the substrate.
Dow Corning® Phase Change Thermal Interface Materials are solid when applied
at room temperature. When heated above 50°C the material becomes a liquid. When
cooled to room temperature, it resolidifies. Mechanical clamping is
required to hold assemblies in place.
For assistance in designing a process tailored to the needs of your
application, contact Dow Corning’s technical experts in the Application Center.