With increased miniaturization of systems and greater circuit density,
today’s electronics generate large amounts of heat. If the heat is not
carried off and dissipated, the operational lifetime and reliability of the
electronics can be reduced. This is a problem that needs to be addressed
for everything from individual devices to electronic modules and
systems.
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If you need a
material:
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Consider
products:
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For highly demanding requirements of heat dissipation
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With high levels of thermal conductivity
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That is structural or to adhere various components together
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With primerless adhesion
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To be used in stress-sensitive applications
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With low durometer values or noncuring compounds
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For use without the need of mixing
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That are one part
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For use around heat-sensitive components that cannot withstand high cure
temperatures
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That cure with moderate heat or a noncuring compound or thermal pad
products
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That will remain in place where applied during cure
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That are nonslump
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That will self-level and fill small spaces
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That are flowable with the lowest viscosity values
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For rapid processing
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With fast cure times or noncuring compounds
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With very low levels of outgassing
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Designated as having “controlled volatility” (CV)
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