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One-Part, Heat-Curable Adhesive Has Been Qualified by Two
Chipmakers
Midland, Mich. — May 8, 2007 — To address the issue of overheating in
advanced flip-chip, ball grid array (FC-BGA) devices, Dow Corning Electronics
today unveiled its DOW CORNING® DA-6534 High-Performance Thermal Adhesive. This
unique, one-part adhesive combines the proven reliability and flexibility of
silicone-based chemistries with a silver filler to achieve high thermal
conductivity and elasticity at high and low temperatures, providing long-term
reliability for today’s leading-edge semiconductor devices.
Achieving thermal resistance of 0.09 cm2 C/W at 24 microns the new adhesive
has already been qualified for manufacturing by two major device makers.
Silicone-based adhesives act as bonding agents for numerous components
throughout the microelectronics industry. As semiconductor devices become more
complex and circuitry shrinks, the heat generated from these devices increases
significantly. To effectively remove this heat, a high thermally conductive and
adaptable thermal interface material (TIM) is needed to perform the dual role
of bonding the chip into its package and transferring heat away from the chip
toward an integrated heat sink.
TIM adhesives must strike a precise balance of physical properties to
protect packaged chips from stresses caused by differences in the co-efficients
of thermal expansion (CTE) among the chip, package and heat sink. With its
novel silicone and silver-based formulation, Dow Corning’s new adhesive
surpasses the performance of traditional TIMs on the market today. Other TIMs
may require high thermal loading of more than 70 percent filler or use ceramic
fillers, both of which can compromise adhesion and thermal reliability.
Alternatives such as epoxy-based adhesives offer substandard adhesion and a
high modulus, which can lead to cracking or voids that degrade the performance
of the packaged chip.
As a thixotropic material, DA-6534 offers good dispensability, and its
bondline thickness (BLT) can be controlled through pressure and time. In
addition, DA-6534 has been designed to be completely inert and not produce any
byproducts, which it achieves through the hydrosilylation reaction of vinyl
polymers and a hydrogen cross-linker.
Dow Corning is displaying its DA-6534 adhesive during SEMICON Singapore, May
8-10.
Dow Corning has a long history of leveraging the unique properties of
silicones in thermally conductive formulations, starting with its
DOW CORNING® 4 electrical insulating compound introduced in 1944 for cooling
magnetos on World War II aircraft. Since then Dow Corning has introduced
hundreds of thermally conductive encapsulants and adhesives for the global
microelectronics industry.
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