Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Continue
Silicones from Dow CorningWe help you invent the future.
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Search
Go
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Tutorials
Applications
Electronics Solutions
Product Resources
Technical Resources

Electronics Solutions


News and Upcoming Events


2012.06.25
Collaboration with SUSS MicroTec on Temporary Bonding Solution for Semiconductor Packaging


Midland, Michigan, USA and Garching, Germany: Dow Corning, a leading supplier of advanced silicon technology and materials to the semiconductor industry, and SUSS MicroTec, a leading supplier of semiconductor processing equipment, today announced their collaboration on a temporary bonding solution for 3D through-silicon via (TSV) semiconductor packaging. As part of this non-exclusive agreement, the companies are developing a material and equipment system solution for high volume manufacturing of 3D TSV packaged devices. Through the collaboration, Dow Corning and SUSS MicroTec are working to overcome the challenges the market is facing in advancing 3D TSV and 3D wafer level packaging (WLP) commercialization.

Comprised of both an adhesive and release layer, the Dow Corning silicon-based material is optimized for simple processing with a bi-layer spin coating and bonding process. Combined with SÜSS MicroTec equipment, the total solution offers the benefits of simple bonding using standard manufacturing methods and provides compatibility with thermal and chemical requirements for via middle and interposer TSV processing, as well as faster room temperature de-bonding required for advanced packaging applications.

Enabling commercialization of TSV technology will allow semiconductor companies to reduce the form factor of semiconductor packages to meet continued consumer demand for smaller, thinner and faster electronic devices with increased functionality. Stacking two or more chips vertically using TSV technology is one of the viable ways to reduce the footprint on the printed circuit board (PCB), though requires the industry to find a solution for handling thin wafers, using temporary bonding.

“SÜSS MicroTec is a recognized leader in wafer bonding and applications for 3D TSV, WLP, and microelectromechanical systems (MEMS) markets. Leveraging their equipment expertise allows Dow Corning to provide customers with access to system solutions for their complex 3D packaging requirements,” commented Jim Helwick, vice president, Dow Corning Electronics Solutions.

“We are very pleased to be collaborating with a technology and materials innovator like Dow Corning.” said Frank P. Averdung, president and CEO of SÜSS MicroTec AG. “Working side by side with Dow Corning expedited process development and this experience will facilitate faster implementation for customers interested in using the Dow Corning and SUSS MicroTec temporary bonding materials and equipment.”

Dow Corning builds on a long history of silicon-based innovation and collaboration in semiconductor packaging. From die encapsulants for stress relief, adhesives for sealing and bonding, or thermal interface materials for performance and reliability, Dow Corning’s well-established global infrastructure ensures reliable supply, quality and support, no matter where you are in the world.

To learn more about how Dow Corning helps you invent the future, please visit dowcorning.com/electronics.

About Dow Corning
Dow Corning (dowcorning.com) provides performance-enhancing solutions to serve the diverse needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and innovation, Dow Corning offers more than 7,000 products and services through the Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by The Dow Chemical Company and Corning, Incorporated. More than half of Dow Corning’s annual sales are outside the United States.

About SÜSS MicroTec
The SÜSS MicroTec AG, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. In close cooperation with research institutes and industry partners SÜSS MicroTec contributes to the advancement of next-generation technologies such as 3D Integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing. With a global infrastructure for applications and service SÜSS MicroTec supports more than 8.000 installed systems worldwide. SÜSS MicroTec is headquartered in Garching near Munich, Germany. For more information, please visit http://www.suss.com


Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites      
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2014 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.