Pressure Sensitive Solutions
News and Upcoming Events
Dow Corning to exhibit at APFE 2012, Booth T10
Dow Corning Corporation, a leader in silicone technology, will
participate in the 7th International Adhesive tape Protective Films
& Optical Film (Shanghai) Expo (APFE 2012) in
China from March 14 – 16, 2012.
Dow Corning will exhibit its lineup of low adhesion pressure sensitive
adhesives (PSAs) and new hard coating materials for protective film
applications. Silicone-based technology offers stable adhesion over time and
superior wet ability and transparency as well as better mar resistance and
anti-scratch than current organic PSAs on PET technology.
The APFE is a unique international business platform for the adhesive
industry and precision die-cutting market. The show offers participants the
opportunity to experience new technologies, products and processing solutions
with a live demonstration of a new touch-screen protection solution.
As a total solution provider, Dow Corning offers a comprehensive
selection of silicone-based adhesives, release coatings and cross-linkers
solutions for PSA tapes protective films and durable labeling.
With more than 65 years as a global leader in silicone solutions, Dow
Corning is committed to providing supportive services tailored to the specific
business needs of the pressure sensitive industry. Dow Corning strives to
continuously develop high-performance technologies that are sustainable and
To learn more about Dow Corning® Pressure Sensitive Solutions, visit
Dow Corning at Booth T10, or dowcorning.com/psi.
About Dow Corning
Dow Corning provides performance-enhancing solutions to serve the diverse
needs of more than 25,000 customers worldwide. A global leader in silicones, silicon-based technology and
innovation, Dow Corning offers more than 7,000 products and services via
the company’s Dow Corning® and XIAMETER® brands. Dow Corning is equally owned by
The Dow Chemical Company and Corning, Incorporated. More than half of
Dow Corning’s annual sales are outside the United States.