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2008.03.11
U.S. Computer Manufacturer to Use Dow Corning Electronics’ TC-5121 Thermally Conductive Compound at Facility in China


New Thermally Conductive Compound Continues to Gain Global Market Acceptance

Dow Corning Corporation’s Electronics and Advanced Technologies group today announced that a U.S.-based personal computer maker has qualified DOW CORNING® TC-5121 Thermally Conductive Compound for use in its manufacturing operations in China. This market win for Dow Corning Electronics reflects the continuing global market acceptance of TC-5121 following its introduction in December.

TC-5121 offers low thermal resistance at 0.1°C-cm2/W and excellent reliability in an easily screen or stencil printable material. Designed for mid-range electronic systems such as desktop computers and graphic processing units, it is part of a family of Dow Corning high-performance thermal greases that includes TC-5022 and TC-5026, which offer even higher performance.

“We are pleased that our newest thermal compound will now be used in manufacturing in China,” said David Hirschi, Dow Corning’s global marketing manager for thermal management materials. “TC-5121 gives customers robust thermal performance and high reliability at a better price than most other intermediate-performance compounds.”

PC manufacturers use thermally conductive compounds to carry heat away from microprocessors, graphics processors and other critical components, typically by applying a thin layer of the compound between a chip and a heat sink. Other emerging markets for these thermal materials include light-emitting diodes, flat-panel displays and a variety of communication and automotive products.

Dow Corning Electronics backs TC-5121 and its entire global product line with world class global applications support.

Dow Corning will conduct a technical workshop on the stability and reliability of thermal interface materials during the upcoming SEMI-THERM 24 conference, March 18-19 at the Fairmont Hotel in San Jose, Calif. Further information and demonstrations of Dow Corning’s thermally conductive compounds will be available at booth #63 during the conference.

Dow Corning’s Electronics and Advanced Technologies Industry serves the needs of the electronics, optoelectronics and semiconductor industries with specialized, high-purity silicone- and silicon-containing products and solutions.

For more information on Dow Corning’s full range of thermal management materials, visit www.dowcorning.com/electronics

About Dow Corning
Dow Corning Corporation is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technologies that help its customers to invent the future. For more information on Dow Corning, visit http://www.dowcorning.com. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE: DOW) and Corning Incorporated (NYSE: GLW). More than half of Dow Corning Corporation’s sales are outside the United States.

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