Electronics Solutions
News and Upcoming Events
2008.03.11
U.S. Computer Manufacturer to Use Dow Corning Electronics’ TC-5121 Thermally Conductive Compound at Facility in China
New Thermally Conductive Compound Continues to Gain Global Market
Acceptance
Dow Corning Corporation’s Electronics and Advanced Technologies group
today announced that a U.S.-based personal computer maker has qualified
DOW CORNING® TC-5121 Thermally Conductive Compound for use in its
manufacturing operations in China. This market win for Dow Corning
Electronics reflects the continuing global market acceptance of TC-5121
following its introduction in December.
TC-5121 offers low thermal resistance at 0.1°C-cm2/W and excellent
reliability in an easily screen or stencil printable material. Designed for
mid-range electronic systems such as desktop computers and graphic processing
units, it is part of a family of Dow Corning high-performance thermal
greases that includes TC-5022 and TC-5026, which offer even higher
performance.
“We are pleased that our newest thermal compound will now be used in
manufacturing in China,” said David Hirschi, Dow Corning’s global
marketing manager for thermal management materials. “TC-5121 gives customers
robust thermal performance and high reliability at a better price than most
other intermediate-performance compounds.”
PC manufacturers use thermally conductive compounds to carry heat away from
microprocessors, graphics processors and other critical components, typically
by applying a thin layer of the compound between a chip and a heat sink. Other
emerging markets for these thermal materials include light-emitting diodes,
flat-panel displays and a variety of communication and automotive products.
Dow Corning Electronics backs TC-5121 and its entire global product
line with world class global applications support.
Dow Corning will conduct a technical workshop on the stability and
reliability of thermal interface materials during the upcoming SEMI-THERM 24
conference, March 18-19 at the Fairmont Hotel in San Jose, Calif. Further
information and demonstrations of Dow Corning’s thermally conductive
compounds will be available at booth #63 during the conference.
Dow Corning’s Electronics and Advanced Technologies Industry serves the
needs of the electronics, optoelectronics and semiconductor industries with
specialized, high-purity silicone- and silicon-containing products and
solutions.
For more information on Dow Corning’s full range of thermal management
materials, visit www.dowcorning.com/electronics
About Dow Corning
Dow Corning Corporation is a globally integrated provider of materials,
application technology and services, and is focused on providing innovative
technologies that help its customers to invent the future. For more information
on Dow Corning, visit http://www.dowcorning.com.
Dow Corning Corporation is equally owned by The Dow Chemical Company
(NYSE: DOW) and Corning Incorporated (NYSE: GLW). More than half of
Dow Corning Corporation’s sales are outside the United States.
For More Information, contact:
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Rhonda Bovin, Dow Corning, + (989) 496 5489, electronics@dowcorning.com
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Bruce Hokanson, Loomis Group, +1 (360) 574 4000, hokanson@loomisgroup.com