TC-5022 improves thermal performance 10-15 percent compared to existing
Midland, Mich. – Dow Corning Corporation today announced that its new
thermally conductive grease, DOW CORNING® TC-5022, has been approved by AMD
for use on its AMD64 processors and inclusion into its bundled
Processor-In-a-Box (PIB) product offerings.
The new thermally conductive grease boosts cooling performance while
minimizing cost of ownership for manufacturers. According to customer testing,
TC-5022 offers a 10-15 percent reduction in thermal resistance, improving
thermal performance over other thermal grease options on the market today.
Used as the thermal “path” between the microprocessor package and its
device-cooling heat sink, the grease provides a highly efficient transfer of
heat away from the processor. This gives integrated circuit makers greater
versatility in selecting heat sink options, including the use of lower cost
heat sinks that enable users to reduce overall manufacturing and system costs.
“Thermal greases like TC-5022 are an important element in the design of new
generations of microprocessor packages,” said Tom Cook, global industry
executive director, Dow Corning. “Because the heat management needs of
high-end devices are increasingly complex, the industry needs materials that
are designed to address both performance and price needs. TC-5022 demonstrates
perfectly how this performance-price balance can be achieved.”
“Enhancing processor heat dissipation is an important industry focus, and AMD
is committed to working with market leaders such as Dow Corning to find
innovative solutions to meet customers’ needs,” said Mike Eyman, member of
Technical Staff at AMD. “TC-5022 is an excellent product that will enhance the
cooling efficiency of AMD’s server, workstation and desktop products.”
Dow Corning introduced TC-5022 earlier this year, expanding the company’s
growing line of conductive greases. TC-5022 allows manufacturers to achieve
low thermal resistance (0.07cm2C/W) with thin bond lines (<25 microns). The
material offers long-term thermal stability and enables pressure-independent
processing, giving users a wide process window to improve manufacturing
consistency, repeatability and overall yield.
Recently, Dow Corning and AMD held a joint online seminar to discuss the use
of TC-5022 and other Dow Corning thermal grease technologies in AMD devices.
Zuchen Lin, technical platform leader at Dow Corning, presented “Dow Corning’s
Thermal Solutions for AMD’s CPU Platforms,” while AMD’s Eyman presented
“Partnership Development of a Thermal Grease Used in AMD’s Processor in Box
Program.” For more information on this online seminar, please contact email@example.com.
About Dow Corning
Dow Corning Corporation is a globally integrated provider of materials,
application technology and services, and is focused on providing innovative
technology for all segments of the electronics industry. Dow Corning has
development and applications centers strategically located throughout Asia,
Europe and the United States. The centers offer advanced resources for
electronics materials and services, and are staffed with experienced
professionals who can provide technical support to customers locally. Dow
Corning Corporation is equally owned by The Dow Chemical Company (NYSE: DOW)
and Corning Incorporated (NYSE: GLW). More than half of Dow Corning
Corporation's sales are outside the United States.
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