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Semiconductor International Lithography Report has chosen a Dow Corning
Electronics’ article as an Editor’s Pick in the September 2007 issue of
Semiconductor International Lithography Report! Dow Corning is very
pleased to see our efforts recognized by the greater lithography community.
This is a widely read and respected publication within the semiconductor
industry resulting in increased awareness for Dow Corning Silicon Lithography
Solutions capabilities. As a new segment within the Device Fabrication Major
Market, Silicon Lithography Solutions is offering custom designed silicon
resins as a raw material to leading photoresist and antireflective material
suppliers.
Read the article, “Silicon-Containing
Materials for Sub-65 nm Etch,” in its entirety from Semiconductor
International magazine. It discusses how silicon-based materials with increased
etch selectivity are capable of extending 193 nm optical lithography to devices
with feature sizes of 45 nm and beyond. The article also describes the
versatility of silicon-based materials for use in either bilayer photoresist
(BLR) or multilayer photoresist (MLR) process schemes.
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