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Dow Corning® TC-5888 Thermally Conductive Compound Improves Production, Performance and Reliability of High-End Electronics
|Dow Corning today introduced
new Dow Corning® TC-5888 Thermally Conductive Compound. The latest
addition to the Company's broad and growing portfolio of solutions for thermal
management, the new material is tailored to address the design and
manufacturing challenges associated with high-performance server applications.
Courtesy of Dow Corning.
Dow Corning, a wholly owned subsidiary of The Dow Chemical Company and a
global leader in silicones, silicon-based technology and innovation, today
introduced new Dow Corning® TC-5888 Thermally Conductive Compound.
The latest addition to the Company’s broad and growing portfolio of solutions
for thermal management, the new material is tailored to address the design and
manufacturing challenges associated with high-performance server
“With the continued growth in cloud computing, data networks and telecom
infrastructure, the demand for reliable server designs continues to grow as
quickly as the demands on their performance,” said Grace Zhang, strategic
marketing manager, Dow Corning. “TC-5888 Thermally Conductive Compound
addresses both of these challenges by combining excellent thermal management
for improved server reliability with a flow profile that enhances both
productivity and precision.”
TC-5888 Thermally Conductive Compound offers the highest bulk thermal
conductivity in Dow Corning’s thermally conductive compound product
portfolio. The material’s combination of high thermal conductivity (5.2 W/m.K)
along with its ability to achieve thin Bond Line Thickness (BLT) of
approximately 20 microns yields low thermal resistance of 0.05 (C.cm2/W). The
end result is a thermal compound that efficiently dissipates heat to
improve performance and reliability of high sensitive server processors.
New TC-5888 thermal compound also features unique rheological properties that
limit its flow beyond a target interface once assembled. This flow
characteristic distinguishes it from lower viscosity thermal compounds, and
provides greater control for applications requiring a thicker thermal compound
layer or greater precision when dispensing compound between surface interfaces
– such as in between large server packages and corresponding heat sinks.
TC-5888 Thermally Conductive Compound also offers low volatile content vs.
competitive thermal compounds, allowing for more consistent rheology,
application repeatability and easier screen printing overall.
Dow Corning® TC-5888 Thermally Conductive Compound is commercially
available worldwide. The company’s broad portfolio of advanced thermally
conductive adhesives, encapsulants, gels and compounds are especially designed
to enable improved performance for many of today’s most demanding
About DowDuPont Materials Science Division
DowDuPont Materials Science, a business division of DowDuPont (NYSE: DWDP),
combines science and technology knowledge to develop premier materials science
solutions that are essential to human progress. The division has one of the
strongest and broadest toolkits in the industry, with robust technology, asset
integration, scale and competitive capabilities that enable it to address
complex global issues. DowDuPont Materials Science’s market-driven,
industry-leading portfolio of advanced materials, industrial intermediates, and
plastics businesses deliver a broad range of differentiated technology-based
products and solutions for customers in high-growth markets such as packaging,
infrastructure, and consumer care. DowDuPont intends to separate the Materials
Science Division into an independent, publicly traded company.
More information can be found at www.dow-dupont.com.
For further information contact:
AH&M Marketing Communications
+1.413.448.2260, Ext. 200