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Power Up Your
Room-Temperature-Curing Coatings

High-heat resistance, room temperature curing (AV24664)
 

Achieve improved flexibility in high-temperature-resistant, room-temperature-curing coatings

Paint formulators are under pressure to deliver more-sustainable coatings. This is reflected in the demand for lower-temperature – and hence lower-energy – curing systems. This is especially relevant to formulators of high-temperature-resistant coatings, which usually require high curing temperatures.

Traditional solutions have been methyl methoxy resins, but these suffer from stress due to their high-crosslink-density curing, which limits flexibility and film build.

With Dow Corning® 2405 Resin, formulators have an option to significantly extend the formulating space for room-temperature-curing, high-temperature-resistant coatings.

Features of Dow Corning® 2405 Resin

  • Room temperature curing without tin catalyst
  • High heat resistance (650°C with black and aluminum pigments)
  • Improved flexibility and impact resistance
  • Solventless delivery
  • Low smoke generation on initial heating
  • Compatible with pure methyl methoxy and traditional phenyl silicone resins
Power Up

Room temperature cure

When catalyzed with TnBT or other catalysts, Dow Corning® 2405 Resin cures within 60 minutes at ambient temperature (20°C) to form a medium-hard and solvent-resistant coating.

Some traditional phenyl resins, such as Dow Corning® RSN-0806 Resin, physically dry to provide high hardness (Figure 1). However, they do not exhibit good cure, and they have little or no solvent resistance.

In contrast, methyl methoxy resins, such as Dow Corning® US-CF 2403 Resin and Dow Corning 2405 Resin, provide medium hardness but very good solvent resistance.

Figure 1. Methyl methoxy resins: high-temperature resistance and room temperature cure

ResinCatalystPendulumDryingMEK Double Rubs
Dow Corning® RSN-0806 ResinNone110-120Dry touch –
physical dry
0
Dow Corning® RSN-0805 ResinNone10-15Slightly sticky –
physical dry
0
Dow Corning® US-CF 2403 Resin0.5% TnBT60-70Dry touch –
reacted
>20
Dow Corning® 2405 Resin0.5% TnBT50-60Dry touch –
reacted
>20

Cure time: 60 minutes at 20°C.

Improved flexibility/impact resistance

For selected substrates and where film thickness can be controlled, formulators can create very fast-curing systems using methyl methoxy resins such Dow Corning® US-CF 2403 Resin. However, the high crosslink density associated with these resins can result in films that are brittle and have poor impact resistance, causing many formulators to avoid using them.

With Dow Corning® 2405 Resin, the cure rate is reduced slightly, but the flexibility and impact resistance are significantly improved (Figure 2).

Figure 2. Flexibility limitations of room-temperature-curing resin

FormulationsImpact Test: Visual Aspect (DFT ~50 µm)
 5 cm10 cm20 cm35 cm
Dow Corning® US-CF 2403 Resin8-9543
Dow Corning® RSN-0805 Resin10101010
Dow Corning® 2405 Resin10101010

All samples incorporating 1% TnBT and 10% aluminum flake.
10 = excellent
1 = very bad (cracked/shattered)

BrittleFlexible
Dow Corning® US-CF 2403 ResinDow Corning® 2405 Resin

Solventless delivery with good build/viscosity

The very low molecular weight of methyl methoxy resins can lead to difficulties in the formulation of easy-to-spray products with good build per coat. However, with the slight increase in molecular weight of Dow Corning® 2405 Resin, formulators have more formulation options to achieve good build with less risk of sags/runs.

Plus, with its solventless delivery, Dow Corning® 2405 Resin may be used for high-solids formulations (and low VOC).

Tin-free curing

Dow Corning® 2405 Resin is catalyzed by titanium compounds, such as TnBT, and does not require the use of tin catalysts.

See Our New Solutions
for Coatings

Learn more
in our interactive
selection guide.

Resources

Dow Corning® 2405 Resin
Product Information Sheet
(PDF)
Interactive Additive Selection Guide

 

Request samples

Dow Corning® 2405 Resin

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