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Silicones from Dow Corning
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Fiberglass Treatment and Composite

Upgrade fiberglass and composite for demanding applications

Improve strength and durability in energy and electronics applications.

Increase Performance for Improved Strength and Durability

Dow Corning® brand Plastic and Composite Additives offer essential components for fiberglass-reinforced resin applications. These components are critical to the strength and durability of composites, and help fabricators meet the demanding needs of their customers. Dow Corning® brand Plastic and Composite Additives can give you an edge in these applications by providing more-effective coupling and dispersion treatments, as well as greater protection against environmental conditions.

Our advanced materials:

  • Enhance the mechanical and electrical properties of fiberglass-reinforced polymers
  • Improve resistance to moisture attack at the interface
  • Increase the strength and durability of composites under wet and dry conditions
  • Provide wet-out and lubrication to the glass fiber
  • Boost fiber strand integrity, production and handling
  • Achieve reliable performance in cycling tests from hot to cold extremes

Contact us now to discover how our creativity and flexibility can help you use Dow Corning® brand Plastic and Composite Additives to find the most innovative solutions for demanding markets like energy, transportation, military and construction.

Applicable Markets and Applications

  • Printed circuit boards - enhanced interfacial compatibility, reactivity and adhesion of treated glass fiber/fabric to thermoset resins and copper foil used in printed circuit board laminates
  • Wind turbine blades
  • Automotive parts
  • Boats
  • Aerospace
  • Construction components
  • Pipes
  • Storage Tanks

Looking to bond inorganic glass fibers to organic resin?

Dow Corning® Z-6269 Silane provides stable bonding between incompatible, non-bonding organic and inorganic substrates with this new high purity bonding agent. Effectively treats fiberglass cloth to bind inorganic glass fibers to organic resin in manufacturing printed circuit board composites.

  • Improves adhesion of epoxy resins to inorganic surfaces, such as fiberglass fabric
  • Wet composite strength
  • Electrical properties
  • Good temperature, chemical and moisture resistance

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Silicone Addittives for Electronics Brochure
(743 KB PDF)
more details in Silicone Additives for Electronics Materials from Dow Corning

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