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Dow Corning Plasma Solutions offers the SE-2000 PlasmaStream
system for the processing of materials in 3D, rigid sheet, or fiber/filament
form.
This jet plasma system carries out surface engineering at
room temperature by applying to the target substrate a stream of plasma emitted
from a proprietary electrode configuration and carrying the liquid deposition
chemistry.
The PlasmaStream system is designed as a stand-alone
system that operates at atmospheric pressure in an open-perimeter mode for easy
processing. It can be configured to treat inflexible sheet substrates such as
glass, circuit boards, and wafers, or can be mounted on a 6-axis robot to treat
3D and profiled substances.
For more information on how the PlasmaStream system
can serve your needs, contact us.
Also available is our Large-Area APPLD Equipment.
Return to Equipment Platforms
Overview.
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