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Reduce
material costs for tomorrow’s photovoltaic devices
Innovations in thin film technologies might signal a shift in the next
generation of photovoltaic devices. With potential cost savings compared to
traditional wafer technology, thin film substrates and superstrates may answer
the challenge of obtaining grid equity and help make solar energy a viable
alternative.
With a significant investment in manufacturing facilities to produce
high-purity monosilane, Dow Corning is furthering its commitment to the
solar industry. Construction of a new facility in Hemlock, Michigan, adjacent
to joint-ventures Hemlock Semiconductor Group’s polysilicon manufacturing site,
will enable Dow Corning to provide a reliable supply of specialty
monosilane gas products.
What is
your thin film challenge?
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The power of collaboration
Contact a Dow Corning PV
expert and discover how we can work together to find solutions for your thin
film substrate and superstrate challenges.
Header photo courtesy DOE/NREL,
credit United Solar Ovonic. |
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Our
solar future
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