Dow Corning expert to speak at PSTC
At the PSTC Tech 30 Global Conference VI this May, Application Engineer Peter Vert will explore the benefits and challenges in siliconizing filmic substrates. He also will discuss new silicone developments that make coating films more practical and cost effective. Read the news release.

Attend the presentation:
Paper or Plastic? New Developments in Siliconizing Filmic Substrates
By: Peter Vert, Dow Corning Corporation
Tech 30 Global Conference VI
May 16,  Session II, 1:30 p.m.
Hyatt Regency Grand Cypress, Orlando, Florida, USA

If you are unable to attend, request a copy of Peter Vert’s presentation.






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Dow Corning to exhibit at Joint FINAT/VskE Congress 2007
May 30 – June 1, 2007
Maritim Hotel Berlin, Berlin, Germany

Talk to us about:

• Silicone release solutions for all types and grades of films
• Information about our proven Advantage Series low-platinum release coating “toolbox”
• Solutions beyond materials – choices, services, expertise, and support