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Laser Mark Format

Dow Corning employs laser mark methodology similar to that identified by Semiconductor Equipment and Materials Institute (SEMI®) guidelines.

Character Orientation:          Readable with the flat down.

Character Dimensions:         Character Height          1.624 +  0.025mm 
                                                    Character Spacing       1.420 + 0.025 mm

Character String: 100 mm wafers

Character String: 100 mm wafers

Character String: 150 mm wafers

Character String: 150 mm wafers

For more information about our laser mark format, contact us.




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