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IMAGINE: Low stress gels for thermal management

Low stress gels for thermal management for electronicsPrinted circuit assemblies often require effective thermal management as well as reliable protection from harsh environmental conditions. For these demanding applications, Dow Corning has developed a broad selection of thermally conductive silicone elastomers and gels for potting delicate components. By offering a versatile selection of silicone material solutions that better maintain thermal conductivity over the lifetime of the application we are able to provide better reliability than our organic counterparts. These fall into two categories:

  1. Encapsulants: Available in a variety of viscosities and cure chemistries, our silicone encapsulants apply easily and cure into rubbery elastomers that provide reliable protection from harsh environmental conditions.
  2. Gels: Due to their remarkably low modulus, our silicone gels are much softer and provide excellent stress relief in addition to dielectric insulation. They are typically used to protect the most sensitive and delicate components against the effects of thermal cycling.

Our thermally conductive encapsulants and gels offer simple room-temperature or heat-accelerated processing. Their low viscosity before cure that enables easy processing and potting of large or oddly shaped components. Whatever your thermal application need, Dow Corning® gels and elastomers are designed to give you excellent performance at the lowest total cost of ownership.

More than a world-class materials supplier, Dow Corning is an expert and dedicated collaborator. If our product finder  cannot identify an off-the shelf solution that meets your precise specifications, or if you are looking for application expertise and support please contact us. Dow Corning’s expertise in thermally conductive encapsulants and gels has helped drive customer success in applications across several end-markets, including automotive, consumer, communications, industrial and energy and LED lighting.

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Thermal Management Solutions for Automotive, Lighting and Industrial Applications.
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Silicone gels help keep circuits and components cool and reliable
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EE-3200 Low Stress Encapsulant
A low viscosity encapsulant
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