Dow Corning Cookie Policy

We use cookies to enhance your experience with Dow Corning. Learn how cookies are used on this website and view our privacy statement.

By continuing to browse this site, you agree and consent for cookies to be used.

Silicones from Dow Corning
Log In | Profile/Preferences | Customer Support | Contact Us      Global (English). Change
Products             Technical Library             Premier Services             About Dow Corning             Careers
Electronics Products
Electronics Solutions
Product Resources
Technical Resources

Die Encapsulants

Primary uses of Dow Corning® and Dow Corning Toray Silicone® encapsulants are to seal, protect, and preserve electrical characteristics of integrated circuit packages. This a dispensable underfill effectively relieving stress caused by the CTE (coefficient of thermal expansion) mismatch between the silicon die and the substrate.  These products have been successfully demonstrated with typical dispensing or liquid injection molding equipment.

Die Encapsulants Overview
Type: One Part
Physical Form: Vacuum dispensable, low viscosity
Special Properties: Chemical adhesion, elastomeric silicone, Moisture pickup <0.2% at 85/85 conditions for >236 hours
Potential Uses: Seal, Protect, preserve electrical characteristics of micro electronic devices requiring good adhesion
Technical DataTutorial

PDF Links will download files in Adobe Acrobat PDF format. For technical information, or to download the free Acrobat Reader, go to Acrobat help.

< back to Electronics Solutions Home Page  
Media Center    |    REACH    |    Site Map    |    Other Dow Corning Websites
Using this website means you understand our Privacy Statement and agree to our Terms & Conditions.
©2000 - 2018 Dow Corning Corporation. All rights reserved. Dow Corning is a registered trademark of Dow Corning Corporation, a wholly owned subsidiary of The Dow Chemical Company.
The Corning portion of the Dow Corning trademark is a trademark of Corning Incorporated, used under license. XIAMETER is a registered trademark of Dow Corning Corporation. We help you invent the future is a trademark of Dow Corning Corporation.®™Trademark of The Dow Chemical Company ("Dow") or an affiliated company of Dow.
Dow Corning complies with the California Transparency in Supply Chains Act.