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Encapsulants Tutorial

Encapsulants (or pottants) are protective materials used to completely embed electronic circuitry. Typically, they are used to isolate circuits from the harmful effects of moisture and other contaminants, provide electrical insulation for high voltages and also protect the circuit and interconnections from thermal and mechanical stresses. Encapsulants are typically applied in thick layers--exceeding 125 mils.

Dow Corning ® silicone encapsulants are supplied as solventless, two part liquid component kits. Many are designed for 1:1 mix ratios (parts A and B).  Others are formulated for mixing at 10:1 ratios (base and curing agent). When the two liquid components are thoroughly mixed, the mixture cures to a flexible elastomer. Some products will cure at room temperature while others are designed to be cured by heat.

 A special class of ultrasoft encapsulants (Gels) also is supplied in a wide range of product offerings and is covered in another tutorial.

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< back to Encapsulants Home Page  
  1. Encapsulants Tutorial

  2. Solutions for Encapsulants

  3. Key Characteristics - Encapsulants tutorial

  4. Potential Applications - Encapsulants tutorial

  5. Thermal Conductivity - Encapsulants Tutorial

  6. Specialty Encapsulants

  7. Specifications and Other Qualifications

  8. Basics of Processing

  9. Packaging and Storage Considerations

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