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Silicones from Dow Corning
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Key Characteristics - Encapsulants tutorial

Dow Corning silicone encapsulants generally possess the following characteristics:

  • Minimal shrinkage
  • No heat generated (exotherm) during cure
  • No solvents or cure by-products
  • Deep section cure
  • Repairable
  • Excellent dielectric properties
  • Cures to a flexible, stress-relieving elastomer
  • Cures in confinement
  • Service range of –45° to 200°C (-49°F to 392°F)

Certain products also include such properties as:

  • Fast RT cure
  • Optical clarity
  • High tear strength
  • Enhanced thermal conductivity
  • UL and Mil Spec compliance
  • Enhanced flame resistance
  • Controlled volatility
  • Extreme low temperature performance

To find a product with the characteristics you want, check the Product Finder

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< back to Encapsulants Home Page  
  1. Encapsulants Tutorial

  2. Solutions for Encapsulants

  3. Key Characteristics - Encapsulants tutorial

  4. Potential Applications - Encapsulants tutorial

  5. Thermal Conductivity - Encapsulants Tutorial

  6. Specialty Encapsulants

  7. Specifications and Other Qualifications

  8. Basics of Processing

  9. Packaging and Storage Considerations

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