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Thermal Conductivity - Encapsulants Tutorial

By the addition of higher levels of fillers, the thermal conductivity of the silicone encapsulants can be increased significantly. Thermally conductive encapsulants function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and act as stress-relieving shock and vibration absorbers over wide temperature and humidity ranges. 
Without the addition of extra fillers, a typical value for the coefficient of thermal conductivity is roughly 0.1 watts/meter-degK. Special filler addition can result in materials ranging from 0.5 to greater than 2.5 watts/meter-degK. Check the Product Finder for a material with the combination of properties to meet the needs of your application.

For more information on thermal products you can visit our Thermally Conductive section of the website.

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< back to Encapsulants Home Page  
  1. Encapsulants Tutorial

  2. Solutions for Encapsulants

  3. Key Characteristics - Encapsulants tutorial

  4. Potential Applications - Encapsulants tutorial

  5. Thermal Conductivity - Encapsulants Tutorial

  6. Specialty Encapsulants

  7. Specifications and Other Qualifications

  8. Basics of Processing

  9. Packaging and Storage Considerations

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