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Low Temperature Gels Overview

Extremely soft, thermal/mechanical shock and vibration damping, excellent dielectric properties, flexible cure schedule, reversion resistant, thick section cure, compatible with automated dispensing equipment, and physical and electrical stability over a wider temperature range
(-80 to 200°C/-112 to 392°F) than the other types of gels.

Potential Uses
Sealing and protecting, by coating, encapsulating, or potting, various electronic devices, especially those with delicate components and exposure to low temperatures.

Dow Corning® Brand Product


3-4155 HV Dielectric Gel Kit

Two-part, fast RT or heat cure, transparent green, UV indicator, high viscosity, low-temperature (-80°C/-112°F) stability

3-6635 Dielectric Gel

One-part, heat cure, clear, low-temperature (-80°C/-112°F) stability

Q3-6575 Dielectric Gel A/B Kit

Two-part RT or heat cure, clear, low-temperature (-80°C/-112°F) stability

EG-3810 Dielectric Gel

One-part, low/high temperature Dielectric Gel

SE 1885 Kit

Two-part, clear, 1:1 low temp heat cure material; low temperature (-80°C/-112°F) stability; low viscosity

SE 1885 M Kit

Two-part, clear, 1:1 low-temperature heat-cure material, low-temperature (-80°C/-112°F) stability, low viscosity, good working time

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Technical Data


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