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Adhesives and Sealants

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Comparison of Product Families

The table below may help with the choice of which product family best fits your process or application.


One-part Moisture Cure RTV

Two-part Room Temperature Condensation Cure

Heat Curing

One or two part




Cure Times

Handleable in 10-120 minutes with full properties in 24-72 hours at room temp. Times will be dependent on bond line thickness.

Handleable in 30 minutes to 4 hrs with full properties in 8 hours to a few days at room temp

Few minutes to about 2 hours depending on the temperature of cure

Bondline Thickness

Generally less than 1/8 inch (3 mm)



Moisture required from the outside atmosphere for cure




Heat required for cure



Yes, generally above 100C, with newer products curing at 90C

Good cure when confined under large area components

No, requires moisture from air



Stress relief to components and interconnections




Cure By-Products





There are also drawbacks to each of the adhesive families to be aware of.  One-part moisture RTV cures can be slow, especially at higher bond line thicknesses or when confined. Two-part room temperature condensation cures have limited working life, once mixed. Heat curing products can sometimes have their cure inhibited by other materials in the electronic part and should be pre-tested for compatibility in the application.

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  1. Adhesives and Sealants Tutorial

  2. Key Characteristics and Properties of Adhesives

  3. Adhesives and Sealants Tutorial - Bonding Mechanisms

  4. Adhesives and Sealants Applications

  5. Comparison of Product Families

  6. Basics of Processing Adhesives

  7. Adhesive Curing Methods

  8. Tell Us What You Need

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