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Thermal Interface - Wet Dispensed

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Thermal Interface Materials Tutorial

With increased miniaturization of systems and increased circuit density, today’s electronics generate large amounts of heat. These trends in electronics will continue to make removal of this excess energy even more critical for future applications. If the heat is not carried off and dissipated, the operational lifetime and reliability of the electronics can be reduced. This is a problem that needs to be addressed for everything from individual devices to electronic modules and systems. 
Heat sinks and fans are mechanical means that are increasingly used to keep the temperature of the electronics at a minimum, but materials also play a critical role. Materials are used to couple the electronics and heat sinks or fan sinks, as well as to couple interfaces with lids, baseplates and heat spreaders. Dow Corning supplies a wide variety of wet dispensed as well as fabricated film and pad thermal interface materials to fit the needs of your application.
The wet dispensed materials include curing adhesives, gels and encapsulants, plus non-curing compounds. These can be used for virtually any device configuration and do an excellent job accommodating high tolerances between surfaces. Check the tutorial on die attach materials  for other types of materials with excellent thermal conductivity.
Dow Corning also supplies many types of thermal interface materials as fabricated films and pads without the need for dispensing or curing. These include thin thermal pads, gap fillers and phase change films.

In addition, we supply more than materials. Dow Corning can help with other concerns such as smooth equipment integration, process design, material and systems testing, or identification of the right supplier of other items, such as heat sinks. Dow Corning provides a single stop for a wide variety of thermal solutions.

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  1. Thermal Interface Materials Tutorial

  2. Why is Heat Bad for Electronic Devices?

  3. Types of Wet Dispensed Thermal Interface Materials

  4. Types of Fabricated Films and Pad Thermal Interface Materials

  5. Key Characteristics – Wet Dispensed Thermal Interface Materials

  6. Key Characteristics – Fabricated Pad and Film Thermal Interface Materials

  7. Potential Applications for Thermal Interface Materials

  8. Testing considerations

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