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Silicones from Dow Corning
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Increase thermal performance and simplify manufacturing

Dow Corning dispensable thermal padsFrom LED Lighting to Telecom applications, the pressure is on electronics manufacturers to maximize the reliability and minimize the cost of their products. As a result, the need for more innovative and cost-effective thermal management is as high as ever, and Dow Corning ® Dispensable Thermal Pads deliver.

Offering a versatile, cost-effective alternative to pre-fabricated thermal pads, Dow Corning’s innovative new product line now enables manufacturers to quickly and precisely print a layer of thermally conductive silicone compound in controllable thicknesses on complex substrates. Moreover, our Dispensable Thermal Pad technology ensures excellent thermal management properties and reduced manufacturing cost.

Dow Corning® Dispensable Thermal Pads Offer Your Electronics and Lighting Applications:

  • Reduced Total Cost of Ownership: As dispensable thermal pads can be dispensed or printed directly onto a substrate, they potentially reduce material cost by 30 to 60 percent by eliminating the waste more common to conventional fabricated thermal pads. This capability also allows Dispensable Thermal Pads to help accelerate manufacturing cycles, further minimizing costs.

  • Enhanced Reliability: Dispensable Thermal Pads contribute to more reliable product performance by protecting against impact, shock and thermal cycling. They also pose a lower risk of drying out compared to conventional thermal grease, which is important for outdoor lighting applications.

  • Enhanced Design and Thermal Management: Offering thermal conductivity as high as 2.5 W/mK, Dispensable Thermal Pads also eliminate the need for fiberglass carriers used in conventional fabricated pads. Thus, the technology can enable thinner bond lines and excellent compression, yet deliver higher thermal resistance.

  • Expanded Manufacturing Latitudes: Dispensable Thermal Pads are compatible with a wide range of efficient application processes, including standard screen or stencil print processes, or via standard dispensing equipment. The materials easily conform to complex and unevenly shaped substrates and cure in place, helping increase throughput and provide greater flexibility over deposited layer thickness.
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