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Silicones from Dow Corning
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Silicone pressure sensitive adhesives (PSAs) have stability and flexibility that is unmatched by organic PSAs. Discover why silicone PSAs can best meet your diverse application needs.

Why Silicone PSAs Over Organic PSAs*?

Silicone vs. Organic PSAs Comparison
*Comparison for reference only with typical material testing under specific conditions.


Explore the Potential

Gain insights into how our high-performance line of silicone pressure sensitive adhesives (PSAs) can be adapted to your needs and enhance your applications.

Substrates for Silicone PSAs:

  • Glass
  • Teflon® film
  • Paper
  • Mylar® PET film
  • Fabric
  • Kapton® polyimide film
  • Plastics
  • Glass cloth
  • Silicone rubber
  • PTFE (polytetrafluoroethylene)
  • Silicone-varnished cloth
  • FEP (fluorinated ethylene propylene)
  • Silicone/glass laminates
  • Aluminum foil
  • Polyester
  • Stainless steel


Key Curing Considerations

Whatever your application needs are, Dow Corning’s globally-trusted pressure sensitive adhesives (PSAs) will help you achieve your most challenging design goals. Read more to discover which cure system will provide you with the best results.

Key Curing Consideration Table


Platinum Cure
  • Requires the addition of a platinum catalyst to develop PSA properties
  • Coating bath should be used within six hours of catalyst addition
  • Adhesives can be cured in vented, continuous coating ovens at low temperatures (80°C, 176°F)
  • On flexible substrates, typical cure speeds range from 1 minute at 125°C (257°F) to 2 minutes at 100°C (212°F)
  • Changing the catalyst level has little impact on the tack, adhesion, or cohesive strength of the cured adhesive


Peroxide Cure
  • A Benzoyl Peroxide catalyst is typically used to develop PSA properties
  • Most consistent results are achieved by using 98% Benzoyl Peroxide; and a complete blending of peroxide and adhesive is best obtained through a 10% solution of peroxide in toluene
  • Coating bath should be used a day after mixing, as peroxide loses its activity quite rapidly in solvent
  • Peroxide concentration can be varied from 0.5% to 3.0% (based on adhesive solids)
  • Increasing peroxide concentration will decrease tack and adhesive strength, but increase cohesive strength of the cured coating
  • Mixing is necessary to achieve uniform results in the finished product
  • Curing the adhesive is a two-step process that requires the use of graded temperatures


Solvent Removal
  • To ensure proper curing, solvent removal is needed after applying the adhesive to the backing material
  • Recommended temperatures range from 65°C to 93°C (150 to 200°F).
  • Higher removal temperatures can cause the peroxide to decompose and crosslink the solvent into the adhesive
  • The length of time for solvent removal should be sufficient to ensure that no solvent is present in the adhesive when it enters the curing zone
  • After the solvent is removed, a tacky, uniform film of adhesive is left on the backing
  • Heat curing can further strengthen the film’s adhesiveness and cohesiveness
  • The amount of cure depends on a number of factors, including the type of catalyst, equipment, and backing material


Oven Dusting
  • The evaporation of volatile silicone in the curing oven can cause the formation of oven dust
  • Two ways to reduce this problem:

    1. Select a silicone PSA with lower volatile silicone content
    2. Use ramped oven zones (oven zones with temperatures that get progressively hotter)


  • For the manufacture of self-wound tapes or laminate constructions with backings such as polyester, Kapton®, Teflon® and other plastic films, the use of a primer may be required to improve anchorage of the cured adhesive to the backing
  • Good anchorage reduces the possibility of adhesive transfer during unwind and ensures clean slitting operations and clean removability following masking

Selecting the Best Silicone PSA

Selecting the Best Silicone PSA

Want to know which solution is right for you?
Discover more with our interactive Silicone PSA guide.

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